Length: 2 Days
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V- & W-Band Antenna Design for Next-Generation Systems Fundamentals Training by Tonex

V- & W-Band Antenna Design for Next-Generation Systems Fundamentals

Modern aerospace, defense, and satellite programs are racing toward V- and W-band to unlock ultra-wide bandwidth, pencil-thin beams, and compact phased arrays. This course grounds engineers in the fundamentals needed to design, integrate, and validate high-frequency antennas where every micron matters. It also addresses secure system behavior at millimeter-wave, where side-lobes, leakage paths, and unintended emissions can expose attack surfaces. Participants learn how beamforming choices influence jamming resilience, how packaging and materials affect electromagnetic signatures, and how to harden links against interception—directly supporting cybersecurity postures in contested environments. Designed for rapid impact over an intensive two-day format.

Learning Objectives

  • Explain propagation, loss mechanisms, and array behavior in V/W-band
  • Compare substrate, ceramic, and packaging options versus cost and yield
  • Analyze manufacturing tolerances and their effect on radiation patterns
  • Build link budgets including atmospheric attenuation and pointing error
  • Co-design antennas with RFICs, feeds, and thermal constraints
  • Apply secure design patterns so antenna choices reinforce cybersecurity

Audience

  • RF and microwave engineers
  • Antenna and array designers
  • Radar and ISR system architects
  • Satellite and deep-space communications engineers
  • Product and test engineers
  • Cybersecurity Professionals

Module 1 – Band Physics Essentials

  • Atmospheric windows and absorption
  • Skin depth and conductor loss
  • Dielectric dispersion effects
  • Surface waves and leakage
  • Mutual coupling behavior
  • Near-field to far-field scaling

Module 2 – Materials and Packaging

  • LTCC, HTCC, and ceramics
  • Advanced laminates selection
  • Wafer-level packaging tradeoffs
  • Connector and waveguide transitions
  • Thermal paths and CTE control
  • Environmental sealing choices

Module 3 – Element and Array Types

  • Patch, slot, and leaky-wave options
  • SIW and substrate-integrated horns
  • On-chip and in-package antennas
  • Phased and hybrid beamformers
  • Sparse and tiled array layouts
  • Dual-pol and wideband elements

Module 4 – Manufacturing Realities

  • Tolerance stacks and yield
  • Etch, plating, and roughness
  • Panelization and DFM rules
  • Inspection and parametric guards
  • Rework versus scrap decisions
  • Supplier capability assessment

Module 5 – Performance and Validation

  • Link budget at V/W-band
  • S-parameters and pattern fidelity
  • OTA chambers and compact ranges
  • Beam squint and calibration
  • Thermal and power handling
  • EMC/EMI and spectral masks

Module 6 – Missions and Robustness

  • Advanced radar requirements
  • Hypersonic tracking constraints
  • Deep-space link margins
  • Interference and jamming resilience
  • Low-probability-of-intercept patterns
  • Security-aware beam management

Elevate your team’s mmWave capability in just two days. Book this Tonex program to compress learning cycles, de-risk your next V/W-band design, and ship systems that are performant, producible, and secure.

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