Certified Advanced Packaging & Integration Specialist (CAPIS) Certification Program by Tonex
This program develops professionals who architect, manufacture, and qualify advanced electronic packaging across 2.5D, 3D stacking, chiplets, and heterogeneous integration. Participants learn reliability engineering, thermal and signal integrity, substrate design, interposer selection, and supply chain readiness for volume production. Emphasis is placed on design for testability, yield ramp, and standards alignment so teams can translate prototypes into scalable products.
The program also addresses risks from counterfeits and tampering in complex packaging flows. Cybersecurity considerations are woven through bill of materials integrity, secure design data exchange, and traceability so engineering chains resist IP theft and malicious alteration. Graduates leave ready to lead cross functional packaging programs that meet performance, cost, and time to market goals.
Learning Objectives
- Explain 2.5D interposer and 3D stacking fundamentals
- Evaluate chiplet interfaces and die to die fabrics
- Model thermal paths and mitigate hotspots
- Diagnose signal integrity and power integrity issues
- Plan reliability testing and qualification strategies
- Apply secure workflows that strengthen packaging cybersecurity
Audience
- Packaging and integration engineers
- Hardware architects and system designers
- Manufacturing and test engineers
- Quality and reliability professionals
- Supply chain and procurement managers
- Cybersecurity Professionals
- Technical program and product managers
Program Modules
Module 1: Heterogeneous Integration Basics
- Integration drivers and trends
- 2.5D vs 3D tradeoffs
- Chiplet interface overview
- Partitioning and floorplanning
- Substrate and interposer choices
- Yield and cost levers
Module 2: Substrates Interposers Materials
- Organic vs silicon substrates
- Silicon interposer routing limits
- Through silicon via considerations
- CTE and warpage management
- Underfill and die attach options
- Material reliability factors
Module 3: Signal Power Thermal Integrity
- High speed channel budgeting
- Power delivery network design
- Decoupling and impedance targets
- Thermal models and junction limits
- Cooling and interface materials
- Co design tradeoff decisions
Module 4: Assembly Test And Reliability
- Bump bonding and micro bumps
- Die placement and alignment
- Inspection and metrology steps
- Design for test structures
- Burn in and accelerated life
- Qualification standards mapping
Module 5: Chiplets Standards And Ecosystem
- UCIe and BoW overview
- PHY and protocol choices
- IP reuse and hardening
- Multi vendor interoperability
- Security and provenance data
- Business and licensing models
Module 6: Manufacturing Readiness And Security
- Process window characterization
- SPC and yield analytics
- Traceability and serialization
- Secure data and tooling flows
- Counterfeit detection methods
- Compliance and audit readiness
Exam Domains
- Advanced Packaging Architectures and Materials
- Signal Power and Thermal Integrity Engineering
- Assembly Test and Reliability Qualification
- Chiplet Interfaces Standards and Ecosystem
- Manufacturing Readiness and Yield Management
- Secure Packaging Supply Chain and Governance
Course Delivery
The course is delivered through a combination of lectures, interactive discussions, hands-on workshops, and project-based learning, facilitated by experts in the field of Certified Advanced Packaging & Integration Specialist. Participants will have access to online resources, including readings, case studies, and tools for practical exercises.
Assessment and Certification
Participants will be assessed through quizzes, assignments, and a capstone project. Upon successful completion of the course, participants will receive a certificate in Certified Advanced Packaging & Integration Specialist.
Question Types
- Multiple Choice Questions (MCQs)
- Scenario-based Questions
Passing Criteria
To pass the Certified Advanced Packaging & Integration Specialist Certification Training exam, candidates must achieve a score of 70% or higher.
Ready to lead next generation packaging and integration programs Join CAPIS by Tonex and accelerate your path to trusted, manufacturable, high performance systems.